000K utf8 1100 $c2015 1500 eng 2050 urn:nbn:de:gbv:8-publ-13831 2051 10.1109/IECON.2015.7392925 3000 Falck, Johannes 3010 Andresen, Markus 3010 Liserre, Marco 4000 Active thermal control of IGBT power electronic converters [Falck, Johannes] 4209 Thermal cycling is one of the main sources of aging and failures in power electronics. A possibility to reduce the stress to semiconductors is to control the amount of losses that occur in the device during operation. This work presents an active thermal controller that aims at reducing the junction temperature variations in the case of variable power profile. The switching frequency of the converter is the parameter that is affected by the active thermal control, while the operation of the converter remains unchanged. The novelty of the approach is that the switching frequency variation is exploited to prevent excessive cooling down of the semiconductor during a power reduction. A thermal model is used to estimate the losses, so the prior knowledge of the mission profile is not needed. The results of the proposed solution are validated with an experimental prototype and a wide-bandwidth temperature measurement system directly applied to the semiconductor chip. Finally, the impacts of the controller on the module's lifetime is estimated. 4950 https://doi.org/10.1109/IECON.2015.7392925$xR$3Volltext$534 4950 https://nbn-resolving.org/urn:nbn:de:gbv:8-publ-13831$xR$3Volltext$534 4961 https://macau.uni-kiel.de/receive/publ_mods_00001383 5051 621.3 5550 IGBT 5550 Junction Temperature Estimation 5550 Lifetime Prediction 5550 Power Electronics Reliability 5550 Thermal Cycling